Thermoelectric module

ABSTRACT

A thermoelectric module may comprise: a first metal support; a first heat conductive layer; a second heat conductive layer and formed from a resin composition; a plurality of first electrodes arranged on the second heat conductive layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a third heat conductive layer arranged on the plurality of second electrodes, and made from the same resin composition as the resin composition that forms the first heat conductive layer; and a second metal support arranged on the third heat conductive layer, wherein the second heat conductive layer is arranged to encompass an upper surface of the first heat conductive layer and a side surface of the first heat conductive layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation Application of prior U.S. patentapplication Ser. No. 16/963,663 filed Jul. 21, 2020, which is a U.S.National Stage Application under 35 U.S.C. § 371 of PCT Application No.PCT/KR2019/000894, filed Jan. 22, 2019, which claims priority to KoreanPatent Application Nos. 10-2018-0008421, filed Jan. 23, 2018 and10-2018-0014198, filed Feb. 5, 2018, whose entire disclosures are herebyincorporated by reference.

BACKGROUND 1. Field

The present invention relates to a thermoelectric module, and moreparticularly, to a substrate and an electrode structure of athermoelectric element.

2. Background

A thermoelectric effect is a phenomenon caused due to movements ofelectrons and holes in a material and means direct energy conversionbetween heat and electricity.

A thermoelectric element is a generic term for a device which uses athermoelectric effect and has a structure in which a P-typethermoelectric material and an N-type thermoelectric material aredisposed between metal electrodes and bonded to form a pair of PNjunctions.

The thermoelectric element may be classified as an element using atemperature variation in electrical resistance, an element using theSeebeck effect in which an electromotive force is generated due to atemperature difference, an element using the Peltier effect which is aphenomenon in which heat absorption or heat radiation occurs due to acurrent and the like.

Thermoelectric elements are widely applied to household appliances,electronic parts, and communication parts. For example, thethermoelectric elements may be applied to cooling devices, heatingdevices, power generation devices, and the like. Accordingly, the demandfor thermoelectric performance of the thermoelectric elements isgradually increasing.

The thermoelectric element includes substrates, electrodes, andthermoelectric legs. A plurality of thermoelectric legs are disposed inthe form of an array between an upper substrate and a lower substrate. Aplurality of upper electrodes are disposed between the plurality ofthermoelectric legs and the upper substrate, and a plurality of lowerelectrodes are disposed between the plurality of thermoelectric legs andthe lower substrate. Here, the plurality of upper electrodes and theplurality of lower electrodes connect the thermoelectric legs in seriesor in parallel.

Generally, each of the upper substrate and the lower substrate may be analuminum oxide (Al2O3) substrate. Owing to a flatness problem, the Al2O3substrate should maintain a thickness of a predetermined level orhigher. Thus, there is a problem in that a total thickness of thethermoelectric element becomes larger.

Meanwhile, when the thermoelectric elements are used for cooling, thethermoelectric elements can be applied to refrigerators or waterpurifiers, but there is a problem in that the thermoelectric elementsare corroded by condensation and moisture due to low temperatureimplementation. In order to solve the above problem, in the related art,a sealing material is directly disposed on a side surface of athermoelectric element to prevent moisture infiltration. However, sincethe sealing material is directly bonded to the thermoelectric element,there is a problem in that heat flow performance is degraded in athermoelectric module.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments will be described in detail with reference to thefollowing drawings in which like reference numerals refer to likeelements wherein:

FIG. 1 is a cross-sectional view illustrating a thermoelectric element.

FIG. 2 is a perspective view illustrating the thermoelectric element.

FIG. 3 is a cross-sectional view illustrating an example of a lowersubstrate of a thermoelectric module.

FIG. 4 is a cross-sectional view illustrating another example of thelower substrate of the thermoelectric module.

FIG. 5 is a cross-sectional view illustrating a lower substrate of athermoelectric module according to one embodiment of the presentinvention.

FIG. 6 is a cross-sectional view illustrating a lower substrate of athermoelectric module according to another embodiment of the presentinvention.

FIG. 7 is a cross-sectional view illustrating a lower substrate of athermoelectric module according to still another embodiment of thepresent invention.

FIG. 8 is a cross-sectional view illustrating a lower substrate of athermoelectric module according to yet another embodiment of the presentinvention.

FIG. 9 is a cross-sectional view illustrating a lower substrate of athermoelectric module according to yet another embodiment of the presentinvention.

FIG. 10 is a cross-sectional view illustrating a thermoelectric moduleaccording to another embodiment of the present invention.

FIG. 11 is a top view illustrating a sealing part of FIG. 10 .

FIG. 12 is a perspective view illustrating a body of FIG. 10 .

FIG. 13 is a cross-sectional view of a thermoelectric module accordingto still another embodiment of the present invention.

FIG. 14 is a top view illustrating a sealing part of a thermoelectricmodule according to still another embodiment of the present invention.

FIG. 15 is a diagram illustrating an example in which the thermoelectricelement according to an embodiment of the present invention is appliedto a water purifier.

FIG. 16 is a diagram illustrating an example in which the thermoelectricelement according to the embodiment of the present invention is appliedto a refrigerator.

DETAILED DESCRIPTION

The present invention may be modified into various forms and may have avariety of embodiments, and, therefore, specific embodiments will beillustrated in the accompanying drawings and described. The embodiments,however, are not to be taken in a sense which limits the presentinvention to the specific embodiments and should be construed to includemodifications, equivalents, or substituents within the spirit andtechnical scope of the present invention.

Also, terms including ordinal numbers such as first, second, and thelike used herein may be used to describe various components, but thevarious components are not limited by these terms. The terms are usedonly for the purpose of distinguishing one component from anothercomponent. For example, without departing from the scope of the presentinvention, a second component may be referred to as a first component,and similarly, a first component may also be referred to as a secondcomponent. The term “and/or” includes a combination of a plurality ofrelated listed items or any one item of the plurality of related listeditems.

When a component is referred to as being “connected” or “coupled” toanother component, it may be directly connected or coupled to anothercomponent, but it should be understood that still another component maybe present between the component and another component. On the contrary,when a component is referred to as being “directly connected” or“directly coupled” to another, it should be understood that stillanother component may not be present between the component and anothercomponent.

The terms used herein are employed to describe only specific embodimentsand are not intended to limit the present invention. Unless the contextclearly dictates otherwise, the singular form includes the plural form.It should be understood that the terms “comprise,” “include,” and “have”specify the presence of stated herein features, numbers, steps,operations, components, elements, or combinations thereof but do notpreclude the presence or possibility of adding one or more otherfeatures, numbers, steps, operations, components, elements, orcombinations thereof.

Unless otherwise defined, all terms including technical or scientificterms used herein have the same meaning as commonly understood by thoseskilled in the art to which the present invention pertains. Generalterms that are defined in a dictionary should be construed as havingmeanings that are consistent in the context of the relevant art and arenot to be interpreted as having an idealistic or excessively formalisticmeaning unless clearly defined in the present application.

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings, the same referencenumerals are given to the same or corresponding components regardless ofa number of the drawing, and a duplicate description thereof will beomitted.

FIG. 1 is a cross-sectional view illustrating a thermoelectric element,and FIG. 2 is a perspective view illustrating the thermoelectricelement.

Referring to FIGS. 1 and 2 , a thermoelectric element 100 includes alower substrate 110, a lower electrode 120, a P-type thermoelectric leg130, an N-type thermoelectric leg 140, an upper electrode 150, and anupper substrate 160.

The lower electrode 120 is disposed between the lower substrate 110 andbottom surfaces of the P-type thermoelectric leg 130 and the N-typethermoelectric leg 140, and the upper electrode 150 is disposed betweenthe upper substrate 160 and top surfaces of the P-type thermoelectricleg 130 and the N-type thermoelectric leg 140. Accordingly, a pluralityof P-type thermoelectric legs 130 and a plurality of N-typethermoelectric legs 140 are electrically connected by the lowerelectrode 120 and the upper electrode 150. The pair of P-typethermoelectric leg 130 and N-type thermoelectric leg 140, which aredisposed between the lower electrode 120 and the upper electrode 150 andelectrically connected to each other, may form a unit cell.

For example, when voltages are applied to the lower electrode 120 andthe upper electrode 150 through lead lines 181 and 182, a substrate inwhich a current flows from the P-type thermoelectric leg 130 to theN-type thermoelectric leg 140 due to the Peltier effect may absorb heatto serve as a heat absorption part, and a substrate in which a currentflows from the N-type thermoelectric leg 140 to the P-typethermoelectric leg 130 may be heated to serve as a heat radiation part.

Here, each of the P-type thermoelectric leg 130 and the N-typethermoelectric leg 140 may be a bismuth telluride (Bi—Te)-basedthermoelectric leg containing Bi and transverse electric (TE) as mainraw materials. The P-type thermoelectric leg 130 at 100 wt % may be athermoelectric leg which includes 99 to 99.999 wt % Bi—Te-based main lowmaterial containing at least one among antimony (Sb), nickel (Ni), Al,Cu, silver (Ag), lead (Pb), boron (B), gallium (Ga), Te, Bi, and indium(In) and includes 0.001 to 1 wt % mixture containing Bi or Te. Forexample, the P-type thermoelectric leg 120 at 100 wt % may includeBi—Se—Te as the main raw material and may further include 0.001 to 1 wt% Bi or Te. The N-type thermoelectric leg 140 may be a thermoelectricleg which includes 99 to 99.999 wt % Bi—Te-based low material containingat least one among selenium (Se), nickel (Ni), aluminum (Al), copper(Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), Te, Bi, andindium (In) and includes 0.001 to 1 wt % mixture containing Bi or Tebased on 100 wt %. For example, the N-type thermoelectric leg 130 at 100wt % may include Bi—Sb—Te as the main raw material and may furtherinclude 0.001 to 1 wt % Bi or Te.

Each of the P-type thermoelectric leg 130 and the N-type thermoelectricleg 140 may be formed in a bulk shape or a stacked shape. Generally, abulk-shaped P-type thermoelectric leg 130 or a bulk-shaped N-typethermoelectric leg 140 may be obtained by heat-treating a thermoelectricmaterial to produce an ingot, crushing and sieving the ingot to obtain athermoelectric leg powder, sintering the thermoelectric leg powder, andcutting the sintered body. A stack-shaped P-type thermoelectric leg 130or a stack-shaped N-type thermoelectric leg 140 may be obtained byapplying a paste containing a thermoelectric material on a sheet-shapedsubstrate to form a unit member, stacking unit members, and cutting thestacked unit members.

In this case, the pair of P-type thermoelectric leg 130 and N-typethermoelectric leg 140 may have the same shape and volume or may havedifferent shapes and volumes. For example, since electrical conductivitycharacteristics of the P-type thermoelectric leg 130 and the N-typethermoelectric leg 140 are different, a height or a cross-sectional areaof the N-type thermoelectric leg 140 may be formed differently from thatof the P-type thermoelectric leg 130.

Performance of a thermoelectric element according to one embodiment ofthe present invention may be expressed by a thermoelectric figure ofmerit ZT. The thermoelectric figure of merit ZT may be expressed byEquation 1.

ZT=α ² ·σ·T/k  [Equation 1]

Here, α is a Seebeck coefficient (V/K), σ is electrical conductivity(S/m), and α2σ is a power factor (W/mK2). Further, T is a temperature,and k is thermal conductivity (W/mK). k may be expressed as a·cp·ρ, a isthermal diffusivity (cm2/S), cp is a specific heat (J/gK), and ρ isdensity (g/cm3).

In order to obtain a thermoelectric figure of merit ZT of thethermoelectric element, a Z value (V/K) is measured using a Z-meter, andthe thermoelectric figure of merit ZT may be calculated using themeasured Z value.

Here, the lower electrode 120 disposed between the lower substrate 110,the P-type thermoelectric leg 130, and the N-type thermoelectric leg140, and the upper electrode 150 disposed between the upper substrate160, the P-type thermoelectric leg 130, and the N-type thermoelectricleg 140 may each include at least one among Cu, Ag, and Ni.

In addition, sizes of the lower substrate 110 and the upper substrate160 may be formed to be different from each other. For example, avolume, a thickness, or an area of one of the lower substrate 110 andthe upper substrate 160 may be formed to be larger than that of theother one thereof. Consequently, heat absorption performance or heatradiation performance of the thermoelectric element may be improved. Forexample, a width of the lower substrate 110 may be formed to be largerthan that of the upper substrate 160. Consequently, lead lines 181 and182 may be easily connected to a lower electrode disposed at a distalend of the lower substrate 110.

In addition, a heat dissipation pattern, e.g., an irregular pattern, maybe formed on at least one surface of the lower substrate 110 and theupper substrate 160. Consequently, the heat dissipation performance ofthe thermoelectric element may be improved. When the irregular patternis formed on a surface in contact with the P-type thermoelectric leg 130or the N-type thermoelectric leg 140, a bonding characteristic betweenthe thermoelectric leg and the substrate may also be improved.

In this case, the P-type thermoelectric leg 130 or the N-typethermoelectric leg 140 may have a cylindrical shape, a polygonal columnshape, an elliptical column shape, or the like.

Alternatively, the P-type thermoelectric leg 130 or the N-typethermoelectric leg 140 may have a stacked structure. For example, theP-type thermoelectric leg or the N-type thermoelectric leg may be formedby a method of stacking a plurality of structures, in which asemiconductor material is applied on a sheet-shaped base substrate, andthen cutting the plurality of structures. Thus, it is possible toprevent a loss of material and improve an electrical conductioncharacteristic.

Alternatively, the P-type thermoelectric leg 130 or the N-typethermoelectric leg 140 may be formed according to a zone melting methodor a powder sintering method. According to the zone melting method, athermoelectric leg is obtained by a method of forming an ingot using athermoelectric material, slowly heating the ingot, refining particles ofthe ingot to be rearranged in a single direction, and then slowlycooling the ingot. According to the powder sintering method, athermoelectric leg is obtained through a process of forming an ingotusing a thermoelectric material, crushing and sieving the ingot toobtain a powder for a thermoelectric leg, and sintering the powder.

FIG. 3 is a cross-sectional view illustrating an example of a lowersubstrate of a thermoelectric module, and FIG. 4 is a cross-sectionalview illustrating another example of the lower substrate of thethermoelectric module.

Referring to FIGS. 3 to 4 , the thermoelectric element 100 may bedisposed on a metal support 200. The lower substrate 110 of thethermoelectric element 100 may be disposed on the metal support 200, anda plurality of lower electrodes 120 may be disposed on the lowersubstrate 110.

Structures of a P-type thermoelectric leg, an N-type thermoelectric leg,an upper electrode, and an upper substrate are the same as thosedescribed with reference to FIGS. 1 to 2 , and thus duplicateddescriptions thereof will be omitted herein.

Referring to FIG. 3 , the lower substrate 110 may be an Al2O3 substrate.In this case, due to a flatness problem of the Al2O3 substrate, athickness T1 of the lower substrate 110 cannot be fabricated to be lessthan or equal to 0.65 mm. When the thickness of the lower substrate 110becomes larger, a thickness of the lower electrode 120 should becomelarger together with the thickness of the lower substrate 110.Consequently, there is a problem in that an overall thickness of thethermoelectric element 100 should become larger.

Referring to FIG. 4 , the lower substrate 110 may be a heat conductivelayer made of a resin composition containing an epoxy resin and aninorganic filler. In this case, since the heat conductive layer does nothave a flatness problem, it is possible to fabricate the heat conductivelayer to have a thickness T2 that is smaller than that of the Al2O3substrate, for example, a thickness that is less than or equal to 0.65mm. In a structure shown in FIG. 4 , the lower electrode 120 may befabricated by a method of arranging a copper (Cu) substrate on a heatconductive layer made of a resin composition containing an epoxy resinand an inorganic filler, compressing the Cu substrate, and then etchingthe Cu substrate in an electrode shape. However, when the thickness ofthe lower substrate 110 becomes less than or equal to 0.65 mm, the lowersubstrate 110 becomes vulnerable to a variation in temperature. Thus,there is a problem in that delamination occurs between the lowersubstrate 110 and the metal support 200 so that reliability of thethermoelectric element 100 is degraded. In this specification, the metalsupport 200 may be interchangeably used with a heat conductive plate.

FIG. 5 is a cross-sectional view illustrating a lower substrate of athermoelectric module according to one embodiment of the presentinvention, FIG. 6 is a cross-sectional view illustrating a lowersubstrate of a thermoelectric module according to another embodiment ofthe present invention, FIG. 7 is a cross-sectional view illustrating alower substrate of a thermoelectric module according to still anotherembodiment of the present invention, FIG. 8 is a cross-sectional viewillustrating a lower substrate of a thermoelectric module according toyet another embodiment of the present invention, and FIG. 9 is across-sectional view illustrating a lower substrate of a thermoelectricmodule according to yet another embodiment of the present invention.

Referring to FIG. 5 , a lower substrate of the thermoelectric module 500according to one embodiment of the present invention includes a metalsupport 510, a first heat conductive layer 520 disposed on the metalsupport 510, a second heat conductive layer 530 disposed on the firstheat conductive layer 520, and a plurality of first electrodes 540disposed on the second heat conductive layer 530. As shown in FIGS. 1and 2 , a pair of P-type thermoelectric leg and N-type thermoelectricleg are disposed on each electrode 540, a structure in which an upperelectrode and an upper substrate are symmetrical to a lower electrodeand a lower substrate may be formed with a plurality of P-typethermoelectric legs and a plurality of N-type thermoelectric legsinterposed therebetween. For example, a plurality of second electrodes(not shown) symmetrical to the plurality of first electrodes 540, afourth heat conductive layer (not shown) symmetrical to the second heatconductive layer 530, and a third heat conductive layer (not shown)symmetrical to the first heat conductive layer 520 may be furtherdisposed on the plurality of P-type thermoelectric legs and theplurality of N-type thermoelectric legs. The first heat conductive layer520, the second heat conductive layer 530, the plurality of firstelectrodes 540, the plurality of P-type thermoelectric legs and theplurality of N-type thermoelectric legs, the plurality of secondelectrodes (not shown), the second heat conductive layer (not shown)symmetrical with the second heat conductive layer 530, and the thirdheat conductive layer (not shown) symmetrical to the first heatconductive layer 520 may be included in the thermoelectric element 100.

Hereinafter, for convenience of description, the metal support 510, thefirst heat conductive layer 520, the second heat conductive layer 530,and the plurality of first electrodes 540, which are disposed below theplurality of P-type thermoelectric legs and the plurality of N-typethermoelectric legs, will be mainly described. However, a structure thatis equal to the above structure may be symmetrically disposed on theplurality of P-type thermoelectric legs and the plurality of N-typethermoelectric legs. That is, the upper substrate may also be formedwith a structure that is equal to the above structure.

The metal support 510 may be made of Al, an Al alloy, Cu, a Cu alloy, orthe like. The metal support 510 may support the first heat conductivelayer 520, the second heat conductive layer 530, the plurality of firstelectrodes 540, the plurality of P-type thermoelectric legs, and theplurality of N-type thermoelectric legs and may be an area which isdirectly bonded to an application to which the thermoelectric element500 according to the embodiment of the present invention is applied. Tothis end, a width of the metal support 510 may be greater than that ofthe first heat conductive layer 520, and a thickness of the metalsupport 510 may be greater than that of the first heat conductive layer520.

The first heat conductive layer 520 is disposed on the metal support 510and made of a resin composition containing an epoxy resin and aninorganic filler. A thickness T3 of the first heat conductive layer 520may range from 0.01 to 0.65 mm, preferably 0.01 to 0.6 mm, and morepreferably 0.01 to 0.55 mm, and thermal conductivity of the first heatconductive layer 520 may be 10 W/mK or more, preferably 20 W/mK or more,and more preferably 30 W/mK or more.

To this end, the epoxy resin may include an epoxy compound and a curingagent. In this case, the curing agent may be included in a volume ratioof 1 to 10 relative to a volume ratio of 10 of the epoxy compound. Here,the epoxy compound may include at least one among a crystalline epoxycompound, an amorphous epoxy compound, and a silicone epoxy compound.The crystalline epoxy compound may include a mesogen structure. Mesogenis a basic unit of a liquid crystal and includes a rigid structure. Inaddition, the amorphous epoxy compound may be a conventional amorphousepoxy compound having two or more epoxy groups in a molecule. Forexample, the amorphous epoxy compound may be glycidyl ethers derivedfrom bisphenol A or bisphenol F. Here, the curing agent may include atleast one among an amine-based curing agent, a phenol-based curingagent, an acid anhydride-based curing agent, a polymercaptan-basedcuring agent, a polyaminoamide-based curing agent, an isocyanate-basedcuring agent, and a block isocyanate-based curing agent, andalternatively, two or more kinds of curing agents may be mixed to beused as the curing agent.

The inorganic filler may include a boron nitride agglomerate in whichAl2O3 and a plurality of plate-like boron nitrides are agglomerated. Theinorganic filler may further include aluminum nitride. Here, a surfaceof the boron nitride agglomerate may be coated with a polymer having thefollowing monomer 1, or at least a part of voids in the boron nitrideagglomerate may be filled with the polymer having the following monomer

The monomer 1 is as follows.

Here, one among R1, R2, R3, and R4 may be H, the remainder thereamongmay be selected from the group consisting of C1 to C3 alkyl, C2 to C3alkene, and C2 to C3 alkyne, and R5 may be a divalent organic linkerhaving a linear, branch, or cyclic shape and a carbon number of 1 to 12.

As one example, one of the remainder among R1, R2, R3, and R4 excludingH may be selected from C2 to C3 alkene, and another one and stillanother one of the remainder thereamong may be selected from C1 to C3alkyl. For example, the polymer according to the embodiment of thepresent invention may include the following monomer 2.

Alternatively, the remainder among R1, R2, R3, and R4 excluding H may bedifferently selected from the group consisting of C1 to C3 alkyl, C2 toC3 alkene, and C2 to C3 alkyne.

As described above, when the polymer according to the monomer 1 or themonomer 2 is applied on the boron nitride agglomerate in which theplate-like boron nitride is agglomerated and at least a part of thevoids in the boron nitride agglomerate are filled with the polymer, anair layer in the boron nitride agglomerates may be minimized to increasethermal conductivity performance of the boron nitride agglomerate, andit is possible to prevent a breakage of the boron nitride agglomerate byincreasing a bonding force between the plate-shaped boron nitrides. Inaddition, when a coating layer is formed on the boron nitrideagglomerate in which the plate-like boron nitride is agglomerated, it iseasy to form a functional group, and, when the functional group isformed on the coating layer of the boron nitride agglomerate, affinitywith a resin may be increased.

In this case, the metal support 510 and the first heat conductive layer520 may be directly bonded without an additional adhesive. To this end,when a resin composition that is equal to the resin compositionconstituting the first heat conductive layer 520 is applied on the metalsupport 510 in an uncured state and the first heat conductive layer 520,which is in the cured state, is stacked on the applied resin compositionand then pressurized at a high temperature, the metal support 510 andthe first heat conductive layer 520 may be directly bonded.

Meanwhile, the second heat conductive layer 530 may be made of a resincomposition including a silicone resin and an inorganic filler. Thesecond heat conductive layer 530 may be disposed between the first heatconductive layer 520 and the plurality of first electrodes 540 and mayserve to bond the first heat conductive layer 520 to the plurality offirst electrodes 540. For example, the silicone resin included in theresin composition constituting the second heat conductive layer 530 maybe polydimethylsiloxane (PDMS), and the inorganic filler included in theresin composition constituting the second heat conductive layer 530 maybe Al2O3. The resin composition may have high thermal conductivityperformance as well as high tensile strength, a high thermal expansioncoefficient, and high bonding performance. Even when the resincomposition is cured, the resin composition may have a flexibleproperty. For example, the resin composition may have thermalconductivity performance of 1.8 W/mK or more and a linear thermalexpansion coefficient of 125 ppm/° C. or more. In addition, the secondheat conductive layer 530 may have a characteristic in which thermalconductivity is lower than that of the first heat conductive layer 520.Thus, the first heat conductive layer 520 and the plurality ofelectrodes 540 may be stably bonded without degradation in thermalconductivity performance. In this case, a thickness T4 of the secondheat conductive layer 530 may be 0.001 to 1 times, preferably 0.01 to0.5 times, and more preferably 0.05 to 0.2 times the thickness T3 of thefirst heat conductive layer 520. When the thickness of the second heatconductive layer 530 is formed in the above numerical range, a bondingforce between the first heat conductive layer 520 and the plurality offirst electrodes 540 may be maintained without degradation in thermalconductivity performance of the first heat conductive layer 520.

To this end, when the resin composition constituting the second heatconductive layer 530 is applied on the first heat conductive layer 520in an uncured state and the plurality of first electrodes 540 arestacked on the applied resin composition and then pressurized, theplurality of first electrodes 540 and the first heat conductive layer520 may be bonded through the second heat conductive layer 530.Accordingly, at least a part of a side surface 542 of each of theplurality of electrodes 540 may be embedded in the second heatconductive layer 530. For example, a thickness H which is 0.1 to 0.9times, preferably 0.2 to 0.8 times, and more preferably 0.3 to 0.7 timesa thickness H of the side surface 542 of each of the plurality ofelectrodes 540 may be embedded in the second heat conductive layer 530.When the thickness H1 of the side surface 542 of each of the pluralityof electrodes 540 embedded in the second heat conductive layer 530 isless than 0.1 times the thickness H of the side surface 542 of each ofthe plurality of first electrodes 540, there is a probability that atleast some of the plurality of first electrodes 540 are separated fromthe second heat conductive layer 530. When the thickness H1 of the sidesurface 542 of each of the plurality of electrodes 540 embedded in thesecond heat conductive layer 530 exceeds 0.9 times the thickness H ofthe side surface 542 of each of the plurality of first electrodes 540,the resin composition constituting the second heat conductive layer 530may flow on at least some of the plurality of first electrodes 540 toweaken the bonding force between the first electrodes 540 and the P-typethermoelectric leg and the bonding force between the first electrodes540 and the N-type thermoelectric leg.

Meanwhile, the second heat conductive layer 530 may be disposed tosurround a top surface 524 of the first heat conductive layer 520 aswell as a side surface 522 thereof and may be disposed on a top surface512 of the metal support 510 in contact with the side surface 522 offirst heat conductive layer 520. When the second heat conductive layer530 is disposed on the top surface 524 of the first heat conductivelayer 520, the side surface 522 of the first heat conductive layer 520,and the top surface 512 of the metal support 510 in contact with theside surface 522 of the first heat conductive layer 520, the bondingforce between the metal support 510 and the first heat conductive layer520 at an edge of the first heat conductive layer 520 may be increased,and it is possible to prevent a problem of delamination of the edge ofthe first heat conductive layer 520, due to a variation in temperature,from the metal support 510.

In addition, since the second heat conductive layer 530 has a highthermal expansion coefficient and a flexible property even when cured,the second heat conductive layer 530 may serve as a buffer against athermal shock due to a variation in temperature, thereby protecting thefirst heat conductive layer 510 and the plurality of first electrodes540.

As described above, in order to arrange the second heat conductive layer530 to surround the top surface 524 of the first heat conductive layer520 as well as the side surface 522 thereof, a width W2 of the secondheat conductive layer 530 may be larger than a width W1 of first heatconductive layer 520. For example, the width W2 of the second heatconductive layer 530 may be 1.01 to 1.2 times the width W1 of the firstheat conductive layer 520. When the width W2 of the second heatconductive layer 530 is greater than the width W1 of the first heatconductive layer 520, the bonding force between the first heatconductive layer 520 and the metal support 510 may be enhanced, and thethermal shock between the first heat conductive layer 520 and theplurality of electrodes 540 may be decreased.

Meanwhile, as shown in FIG. 6 , the second heat conductive layer 530 mayfurther extend on the metal support 510 in a direction parallel to thetop surface 512 of the metal support 510. An extended width W3 may be0.001 to 0.2 times, and preferably 0.01 to 0.1 times the width W2 of thesecond heat conductive layer 530 having the structure shown in FIG. 5 .As described above, when the second heat conductive layer 530 furtherextends on the metal support 510 in the direction parallel to the topsurface 512 of the metal support 510, a contact area between the secondheat conductive layer 530 and the metal support 510 is increased so thatit is possible to prevent a problem of delamination of the edge of thefirst heat conductive layer 520 from the metal support 510.

Alternatively, as shown in FIG. 7 , the second heat conductive layer 530may be disposed in a shape spreading to a side from the side surface 522of the first heat conductive layer 520. That is, the thickness T4 of thesecond heat conductive layer 530 may be formed to be thickest at theside surface 522 of the first heat conductive layer 520 and may becomethinner in a direction away from the side surface 522 of the first heatconductive layer 520. As described above, when a width W4 of the secondheat conductive layer 530 is disposed to be increased, the contact areabetween the second heat conductive layer 530 and the metal support 510is increased so that it is possible to solve a problem of delaminationof the first heat conductive layer 520 and the metal support 510.

Alternatively, as shown in FIG. 8 , a groove 514 may be formed in themetal support 510, and the second heat conductive layer 530 may befurther disposed in the groove 514 of the metal support 510. The groove514 may be formed along the edge of the first heat conductive layer 520,a depth D of the groove 514 may be formed 0.001 to 2 times, preferably0.01 to 1 times, and more preferably 0.1 to 1 times the thickness T3 ofthe first heat conductive layer 520. As described above, when the groove514 is formed in the metal support 510 and the second heat conductivelayer 530 is further disposed in the groove 514, the contact areabetween the second heat conductive layer 530 and the metal support 510is increased so that it is possible to prevent the problem ofdelamination of the edge of the first heat conductive layer 520 from themetal support 510. In this case, the groove 514 may be formed on the topsurface of the metal support 510 in a continuous shape along the edge ofthe first heat conductive layer 520. Alternatively, a plurality ofgrooves 514 may be formed on the top surface of the metal support 510 inthe form of a dashed line to be spaced at predetermined intervals alongthe edge of the first heat conductive layer 520.

Alternatively, as shown in FIG. 9 , a width W5 of the second heatconductive layer 530 disposed on the side surface 522 of the first heatconductive layer 520 may be greater than a width W6 of the groove 514 ofthe metal support 510. That is, the width W6 of the second heatconductive layer 530 disposed in the groove 514 may be smaller than thewidth W5 of the second heat conductive layer 530 disposed on the sidesurface 522 of the first heat conductive layer 520. As described above,when a width W5 of the second heat conductive layer 530 is disposed tobe increased, the contact area between the second heat conductive layer530 and the metal support 510 is increased so that it is possible tosolve the problem of delamination of the edge of the first heatconductive layer 520 from the metal support 510. Alternatively, as notshown in the drawings, the width W5 of the second heat conductive layer530 disposed on the side surface 522 of the first heat conductive layer520 may be greater than the width W6 of the groove 514 of the metalsupport 510 and may be disposed to be in contact with the top surface512 of the metal support 510.

FIG. 10 is a cross-sectional view illustrating a thermoelectric moduleaccording to another embodiment of the present invention. FIG. 11 is atop view illustrating a sealing part of FIG. 10 , and FIG. 12 is aperspective view illustrating a body of FIG. 10 .

Hereinafter, a thermoelectric module 1000 according to the embodiment ofthe present invention will be described with reference to FIGS. 10 to 12.

Referring to FIGS. 10 to 12 , the thermoelectric module 1000 may includea thermoelectric element 100, a first heat conductive plate 200, asecond heat conductive plate 300, and a sealing part 400.

Here, the thermoelectric element 100 may be the thermoelectric elementdescribed with reference to FIGS. 1 to 9 , and at least one among alower substrate, a lower electrode, an upper substrate, and an upperelectrode of the thermoelectric element 100 may have the structure ofthe embodiment described with reference to FIGS. 5 to 9 . The first heatconductive plate 200 may be the metal support 200 described withreference to FIGS. 3 and 4 or the metal support 510 described withreference to FIGS. 5 to 9 , and the same description as that of thefirst heat conductive plate 200 may be applied to the second heatconductive plate 300.

According to the embodiment of the present invention, the first heatconductive plate 200 and the second heat conductive plate 300 areopposite to each other with the thermoelectric element 100 interposedtherebetween. The first heat conductive plate 200 and the second heatconductive plate 300 may each be made of a metal material havingexcellent thermal conductivity.

Here, the first heat conductive plate 200 is installed between a heatabsorption surface and a surface of a cooling side (not shown) of thethermoelectric element 100 to increase a heat transfer area when heat isabsorbed through the heat absorption surface of the thermoelectricelement 100. In this case, Al is used as the first heat conductive plate200, and alternatively, Cu, stainless steel, or brass may be used as thefirst heat conductive plate 200.

In order to increase the heat transfer area when the first heatconductive plate 200 is used, the first heat conductive plate 200 mayreduce a temperature gradient by including a plurality of heat radiationfins 201. Most of all, a gap between the cooling side (not shown) andthe second heat conductive plate 300 bonded in a direction of a heatradiation surface of the thermoelectric element 100 is intentionallymaintained so that it is possible to block heat from being transferredfrom the relatively hot second heat conductive plate 300 to the coldcooling side (not shown).

The second heat conductive plate 300 is pressed against the heatradiation surface of the thermoelectric element 100 to radiate heat fromthe thermoelectric element 100. Generally, an extruded-type heatradiation plate is commonly used as the second heat conductive plate300. In some cases, a skiving type heat radiation plate, a heat pipeembedded type heat radiation plate, or a fin-bonded type heat radiationplate may be used as the second heat conductive plate 300.

In order to increase the heat transfer area, the second heat conductiveplate 300 may include a plurality of heat radiation fins 301 and a step310 for arranging the sealing part 400 in a corner area.

Here, although it has been described that the first heat conductiveplate 200 is set as the heat absorption surface and the second heatconductive plate 300 is set as the heat radiation surface, the heatabsorption surface and the heat radiation surface may be interchangedaccording to a direction of a current applied to the thermoelectricelement.

The sealing part 400 may include a body 410 and sealing members 421,422, 431, 432, 433, and 434.

The body 410 may have a first height H1 and a substantial hexahedralshape having a bottom surface 411, a top surface 412, and side surfaces.Alternatively, the body 410 may have a cylindrical shape having thebottom surface 411, the top surface 412, and an outer circumferentialsurface.

The body 410 may be made of expanded polystyrene (EPS).

The EPS is lightweight and has excellent formability, excellent heatresistance and heat insulation, density controllability, and excellentwaterproof and dust-proof performance so that the EPS may provideexcellent effects in terms of economy and product reliability.

The bottom surface 411 of the body 410 may include a first groove 413concavely formed from the bottom surface 411 at a second depth H2.

In addition, the top surface 413 of the body 410 may include a secondgroove 414 concavely formed from the top surface 413 at a second depthH2.

A bottom surface of the first groove 413 may be spaced a third height H3from a bottom surface of the second groove 414.

Here, the first height H1 may be set three to five times the secondheight H2. Here, the third height H3 may be set one to three times thesecond height H2.

When the first height H1 of the body 410 is less than three times thesecond heights H2 of the first groove 413 and the second groove 414, thethird height H3 which is a distance between the first groove 413 and thesecond groove 414 becomes relatively smaller so that it is difficult tosecure structural rigidity of the body 410. When the first height H1 ofthe body 410 exceeds 5 times the second heights H2 of the first groove413 and the second grooves 414, a path of moisture which may beintroduced along inner surfaces of the first grooves 413 and the secondgrooves 414 is shortened so that there is a problem in that it isdifficult to secure reliability for waterproof and dust-proofperformance or a volume of the thermoelectric module 1000 is increased.

Each of the first groove 413 and the second groove 414 has a squareshape or a circular shape with a closed circumference.

The body 410 may include a hole 415 formed at an approximate centerthereof to pass through the bottom surface 411 and the top surface 412.

The hole 415 forms an accommodation space for accommodating thethermoelectric element 100, and the thermoelectric element 100 may beaccommodated in the accommodation space of the hole 415.

Meanwhile, the accommodation space may be formed in the range of 1.1 tofive times a volume of the thermoelectric element 100. More preferably,the accommodation space may be implemented in the range of two to threetimes the volume of the thermoelectric element 100.

When the accommodation space is less than or equal to 1.1 times thevolume of the thermoelectric element 100, since a heat flow space is notsecured in a side surface of the thermoelectric element 100, heat flowperformance is not expected to improve. When the accommodation space isgreater than or equal to five times the volume of the thermoelectricelement 100, there is a problem of increasing the volume of thethermoelectric module 1000 without expecting improvement in the heatflow performance due to expansion of the accommodation space S.

That is, the thermoelectric module 1000 according to one embodiment ofthe present invention may expand heat flow, which is generated due to adifference in temperature between the lower substrate and the uppersubstrate of the thermoelectric element 100, to a side portion of thethermoelectric element 100 so that reliability due to the heat flow maybe secured.

Here, an inner side surface 416 of the hole 415 of the body 410 is incontact with the side surface of the thermoelectric element 100 so thatmovement of the thermoelectric element 100 may be prevented.

That is, a shape and a diameter of the hole 415 of the body 410 may beeasily designed and changed according to the shape of the thermoelectricelement 100.

In addition, one side surface of the body 410 may include a through-hole417 through which the lead lines 181 and 182 of the thermoelectricelement 100 are drawn out to the outside.

Meanwhile, the through-hole 417 may have a fourth height H4 from thebottom surface 411 of the body 410, and the fourth height H4 may belarger than the second height H2 of the first groove 413.

The sealing members 421, 422, 431, 432, 433, and 434 may include a firstsealing member 421, a second sealing member 422, a third sealing member431, a fourth sealing member 432, a fifth sealing member 433, and asixth sealing member 434.

The first sealing member 421 is disposed to be inserted into the firstgroove 413 in the bottom surface 411 of the body 410 and seals toprevent moisture from infiltrating into the body 410.

Here, it is preferable that the first sealing member 421 is implementedas waterproof silicone or the like which is introduced into the firstgroove 413 before being cured to be capable of bonding the first groove413 to the first heat conductive plate 200.

The second sealing member 422 is disposed to be inserted into the firstgroove 414 in the top surface 412 of the body 410 and seals to preventmoisture from infiltrating into the body 410.

Here, it is preferable that the second sealing member 422 is implementedas waterproof silicone or the like which is introduced into the secondgroove 414 before being cured to be capable of bonding the second groove414 to the second heat conductive plate 300.

Each of the third sealing member 431, the fourth sealing member 432, thefifth sealing member 433 and the sixth sealing member 434 may be made ofwaterproof tape, waterproof silicone, or an adhesive made of a rubber orresin material, thereby bonding the body 410 to the first heatconductive plate 200 and the second heat conductive plate 300.

That is, it is possible to improve the bonding force and sealabilitybetween the first heat conductive plate 200, the second heat conductiveplate 300, and the body 410 through the third sealing member 431, thefourth sealing member 432, the fifth sealing member 433, and the sixthsealing member 434.

Meanwhile, the third sealing member 431 and the fourth sealing member432 may be disposed between the bottom surface 411 of the body 410 andthe first heat conductive plate 200, and the fifth sealing member 433and the sixth sealing member 434 may be disposed between the top surface412 of the body 410 and the second heat conductive plate 300.

The third sealing member 431 may be disposed between the first groove413 and the hole 415 on the bottom surface 411 of the body 410 and mayhave a square shape or a circular shape with a closed circumference.

The fourth sealing member 432 may be disposed between the first groove413 and an outer surface thereof on the bottom surface 411 of the body410 and may have a square shape or a circular shape with a closedcircumference.

The fifth sealing member 433 may be disposed between the second groove414 and the hole 415 on the top surface 412 of the body 410 and may havea square shape or a circular shape with a closed circumference.

The sixth sealing member 434 may be disposed between the second groove414 and an outer surface thereof on the top surface 412 of the body 410and may have a square shape or a circular shape with a closedcircumference.

FIG. 13 is a cross-sectional view of a thermoelectric module accordingto still another embodiment of the present invention, and FIG. 14 is atop view illustrating a sealing part of a thermoelectric moduleaccording to still another embodiment of the present invention.

As compared with the thermoelectric module 1000 according to oneembodiment of the present invention shown in FIG. 10 , a thermoelectricmodule 2000 shown in FIGS. 13 and 14 has a different configuration of asealing part 600. Thus, hereinafter, only the different configuration ofthe sealing part 600 will be described in detail, and detaileddescriptions of duplicated reference numerals in the same configurationwill be omitted herein.

The sealing part 600 may include a body 610 and sealing members 421,422, 431, 432, 433, and 434.

The body 610 may include an engagement hole 418 passing through thebottom surface 411 and the top surface 412 between the first groove 413and an outer surface of the body 610.

In addition, the body 610 may include engagement holes 210 and 320passing through the first heat conductive plate 200 and the second heatconductive plate 300 at a position corresponding to the engagement hole418.

A first engagement member 710, such as a bolt, may be inserted into theengagement hole 418 of the body 610, the engagement hole 210 of thefirst heat conductive plate 200, and the engagement hole 320 of thesecond heat conductive plate 300, and a second engagement member 720,such as a nut, may be engaged at a side opposite to the insertion side.

That is, the first heat conductive plate 200, the body 610, and thesecond heat conductive plate 300 may be more firmly coupled through theengagement of the first engagement member 710 and the second engagementmember 720, and deformation due to heat may be prevented.

Hereinafter, an example in which the thermoelectric element according toan embodiment of the present invention is applied to a water purifierwill be described with reference to FIG. 15 .

FIG. 15 is a diagram illustrating an example in which the thermoelectricelement according to an embodiment of the present invention is appliedto a water purifier.

A water purifier 1 to which the thermoelectric element according to theembodiment of the present invention is applied includes a raw watersupply pipe 12 a, a water purification tank inlet pipe 12 b, a waterpurification tank 12, a filter assembly 13, a cooling fan 14, a heatstorage tank 15, a cold water supply pipe 15 a, and the thermoelectricmodule 1000.

The raw water supply pipe 12 a is a supply pipe for introducing water,which is a purification target, from a water source into the filterassembly 13, the water purification tank inlet pipe 12 b is an inletpipe for introducing the water, which is purified in the filter assembly13, into the water purification tank 12, and the cold water supply pipe15 a is a supply pipe for finally supplying cold water, which is cooledat a predetermined temperature due to the thermoelectric module 1000 inthe water purification tank 12, to a user.

The water purification tank 12 temporarily stores and supplies thewater, which is purified by passing through the filter assembly 13 andis introduced through the water purification tank inlet pipe 12 b, tothe outside.

The filter assembly 13 includes a precipitation filter 13 a, a precarbon filter 13 b, a membrane filter 13 c, and a post carbon filter 13d.

That is, the water introduced into the raw water supply pipe 12 a may bepurified while passing through the filter assembly 13.

The heat storage tank 15 is disposed between the water purification tank12 and the thermoelectric module 1000 and stores cold air formed in thethermoelectric module 1000. The cold air stored in the heat storage tank15 is supplied to the water purification tank 12 to cool the wateraccommodated in the water purification tank 120.

In order to facilitate transfer of the cold air, the heat storage tank15 may be in surface contact with the water purification tank 12.

As described above, the thermoelectric module 1000 includes the heatabsorption surface and the heat radiation surface, and one side of thethermoelectric module 1000 is cooled and the other side thereof isheated due to electron movements in a P-type semiconductor and an N-typesemiconductor.

Here, the one side may be a side of the water purification tank 12, andthe other side may be a side opposite to the water purification tank 12.

In addition, as described above, the thermoelectric module 1000 hasexcellent waterproof and dust-proof performance and improved heat flowperformance so that the thermoelectric module 1000 may efficiently coolthe water purification tank 12 in the water purifier.

Hereinafter, an example in which the thermoelectric element according toan embodiment of the present invention is applied to a refrigerator willbe described with reference to FIG. 16 .

FIG. 16 is a diagram illustrating an example in which the thermoelectricelement according to the embodiment of the present invention is appliedto a refrigerator.

The refrigerator includes a deep temperature evaporation chamber cover23, an evaporation chamber partition wall 24, a main evaporator 25, acooling fan 26, and a thermoelectric module 1000 in a deep temperatureevaporation chamber.

An interior of the refrigerator is divided into a deep temperaturestorage chamber and the deep temperature evaporation chamber by the deeptemperature evaporation chamber cover 23.

Specifically, an inner space corresponding to a front side of the deeptemperature evaporation chamber cover 23 may be defined as the deeptemperature storage chamber, and an inner space corresponding to a rearside of the deep temperature evaporation chamber cover 23 may be definedas the deep temperature evaporation chamber.

A discharge grille 23 a and a suction grille 23 b may be formed on afront surface of the deep temperature evaporation chamber cover 23.

The evaporation chamber partition wall 24 is installed at a positionseparated from a rear wall of an inner cabinet to the front side,thereby partitioning a space in which a deep temperature storage systemis provided from a space in which the main evaporator 25 is provided.

Cold air cooled by the main evaporator 25 is supplied to a freezingcompartment and then returned to the main evaporator.

The thermoelectric module 1000 is accommodated in the deep temperatureevaporation chamber and has a structure in which the heat absorptionsurface faces a drawer assembly and the heat radiation surface faces anevaporator. Thus, a heat absorption phenomenon generated due to thethermoelectric module 1000 may be utilized to rapidly cool food storedin the drawer assembly at an ultra-low temperature that is less than orequal to 50 degrees Celsius.

In addition, as described above, the thermoelectric module 1000 hasexcellent waterproof and dust-proof performance and improved heat flowperformance so that the thermoelectric module 1000 may efficiently coolthe drawer assembly in the refrigerator.

The thermoelectric element according to the embodiment of the presentinvention may be applied to a power generation device, a cooling device,and a heating device. Specifically, the thermoelectric element accordingto the embodiment of the present invention may be mainly applied tooptical communication modules, sensors, medical devices, measurementdevices, the aerospace industry, refrigerators, chillers, vehicleventilation seats, cup holders, washing machines, dryers, wine cellars,water purifiers, power supplies for sensors, thermopiles, and the like.

Here, an example in which the thermoelectric element according to theembodiment of the present invention is applied to a medical deviceincludes a polymerase chain reaction (PCR) device. The PCR device is adevice for amplifying deoxyribonucleic acid (DNA) to determine a DNAbase sequence and requires accurate temperature control and a thermalcycle. To this end, a Peltier-based thermoelectric element may beapplied.

Another example in which the thermoelectric element according to theembodiment of the present invention is applied to a medical deviceincludes a photo detector. Here, the photo detector includes aninfrared/ultraviolet detector, a charge coupled device (CCD) sensor, anX-ray detector, and a thermoelectric thermal reference source (TTRS).The Peltier-based thermoelectric element may be applied so as to coolthe photo detector. Accordingly, it is possible to prevent a variationin wavelength, a decrease in output, and degradation in resolution dueto an increase in temperature in the photo detector.

Still other examples in which the thermoelectric element according tothe embodiment of the present invention is applied to medical devicesinclude an immunoassay field, an in vitro diagnostics field, generaltemperature control and cooling systems, a physical therapy field, aliquid chiller system, and a blood/plasma temperature control field.Accordingly, accurate temperature control is possible.

As another example in which the thermoelectric element according to theembodiment of the present invention is applied to a medical device,there is an artificial heart. Accordingly, power may be supplied to theartificial heart.

Examples of the thermoelectric element according to the embodiment ofthe present invention applied to the aerospace industry include a startracking system, a thermal imaging camera, an infrared/ultravioletdetector, a CCD sensor, the Hubble space telescope, and a TTRS.Accordingly, it is possible to maintain a temperature of an imagesensor.

Other examples in which the thermoelectric element according to theembodiment of the present invention is applied to the aerospace industryinclude a cooling device, a heater, and a power generation device.

In addition to the above description, the thermoelectric elementaccording to the embodiment of the present invention may be applied topower generation, cooling, and heating in other industrial fields.

Although the description has been made with reference to the exemplaryembodiments of the present invention, it should be understood thatvarious alternations and modifications of the present invention can bedevised by those skilled in the art to which the present inventionpertains without departing from the spirit and scope of the presentinvention, which are defined by the appended claims.

Technical Problem

The present invention is directed to providing a substrate and anelectrode structure of a thermoelectric element.

The present invention is also directed to providing a sealing structureof a thermoelectric module.

Technical Solution

One aspect of the present invention provides a thermoelectric moduleincluding a first metal support, a first heat conductive layer disposedon the first metal support and made of a resin composition containing anepoxy resin and an inorganic filler, a second heat conductive layerdisposed on the first heat conductive layer and made of a resincomposition containing a silicone resin and an inorganic filler, aplurality of first electrodes disposed on the second heat conductivelayer, a plurality of P-type thermoelectric legs and a plurality ofN-type thermoelectric legs which are alternately disposed on theplurality of first electrodes, a plurality of second electrodes disposedon the plurality of P-type thermoelectric legs and the plurality ofN-type thermoelectric legs, a third heat conductive layer disposed onthe plurality of second electrodes and made of a resin composition thatis equal to the resin composition forming the first heat conductivelayer, and a second metal support disposed on the third heat conductivelayer, wherein the second heat conductive layer is disposed to surrounda top surface and a side surface of the first heat conductive layer.

A width of the first metal support may be greater than a width of thefirst heat conductive layer, and a second heat conductive layer may befurther disposed on the side surface of the first heat conductive layerand disposed on at least a portion of a top surface of the first metalsupport.

The thermoelectric module may further include a fourth heat conductivelayer disposed between the plurality of second electrodes and the thirdheat conductive layer and made of a resin composition that is equal tothe resin composition forming the second heat conductive layer, and thefourth heat conductive layer may be disposed to surround a top surfaceand side surfaces of the third heat conductive layer.

A width of the second heat conductive layer may be 1.01 to 1.2 times thewidth of the first heat conductive layer.

The second heat conductive layer may bond the first heat conductivelayer to the plurality of first electrodes.

The second heat conductive layer may further bond the first heatconductive layer to the first metal support.

At least a part of side surfaces of the plurality of first electrodesmay be embedded in the second heat conductive layer.

A thickness that is 0.1 to 0.9 times a thickness of each of the sidesurfaces of the plurality of first electrodes is embedded in the secondheat conductive layer.

An inorganic filler contained in the resin composition forming the firstheat conductive layer may include at least one among aluminum oxide,aluminum nitride, and boron nitride.

The boron nitride may be a boron nitride agglomerate in which plate-likeboron nitrides are agglomerated.

A silicone resin included in the resin composition constituting thesecond heat conductive layer may be polydimethylsiloxane (PDMS), and aninorganic filler included in the resin composition constituting thesecond heat conductive layer may be aluminum oxide.

Another aspect of the present invention provides a thermoelectric moduleincluding a first heat conductive plate, a thermoelectric elementdisposed on the first heat conductive plate, a second heat conductiveplate disposed on the thermoelectric element, and a sealing partsurrounding the thermoelectric element and disposed between the firstheat conductive plate and the second heat conductive plate, wherein thethermoelectric element includes a first substrate, a plurality ofthermoelectric legs disposed on the first substrate, a second substratedisposed on the plurality of thermoelectric legs, an electrode includinga plurality of first electrodes disposed between the first substrate andthe plurality of thermoelectric legs and a plurality of secondelectrodes disposed between the second substrate and the plurality ofthermoelectric legs, and a lead line electrically connected to theelectrode, and wherein the sealing part includes a body in which a holeis formed in a central portion thereof so as to accommodate thethermoelectric element, and a sealing member disposed between a bottomsurface of the body and the first metal support and between a topsurface of the body and the second metal support.

The body may include a first groove formed at a predetermined depth inthe bottom surface and formed along a circumference of the hole, and asecond groove formed at a predetermined depth in the top surface andformed along the circumference of the hole.

The sealing member may include a first sealing member inserted into thefirst groove of the body, and a second sealing member inserted into thesecond groove of the body.

The sealing member may further include a third sealing member disposedbetween the first groove and the hole on the bottom surface of the body,and a fourth sealing member disposed between the first groove and anouter corner of the body on the bottom surface of the body.

Each of the third sealing member and the fourth sealing member may havea shape with a closed circumference.

The sealing member may further include a fifth sealing member disposedbetween the second groove and the hole on the top surface of the body,and a sixth sealing member disposed between the second groove and theouter corner of the body on the top surface of the body.

Each of the fifth sealing member and the sixth sealing member may have ashape with a closed circumference.

The first substrate may be disposed on the first heat conductive plateand may include a first heat conductive layer made of a resincomposition containing an epoxy resin and an inorganic filler and asecond heat conductive layer disposed on the first heat conductive layerand made of a resin composition containing a silicone resin and aninorganic filler.

The body may include a through-hole through which a first lead wire anda second lead wire pass.

A height of the body may be three to five times a depth of the firstgroove.

A shortest distance between the first groove and the second groove maybe one to three times the depth of the first groove.

The depth of the first groove may be smaller than a shortest distancefrom the bottom surface of the body to the through-hole.

The body may be expanded polystyrene (EPS).

Each of the first heat conductive plate, the body, and the second heatconductive plate may include an engagement hole passing through from topto bottom, and an engagement member inserted into the engagement hole toengage the first heat conductive plate, the body, and the second heatconductive plate may be further included.

Advantageous Effects

In accordance with embodiments of the present invention, athermoelectric element having excellent thermal conductivity and highreliability can be provided. In particular, the thermoelectric elementaccording to the embodiments of the present invention can be implementedwith a thin thickness and can have high resistance to a variation intemperature so that damage or a delamination phenomenon due to thevariation in temperature can be minimized.

In accordance with another embodiment of the present invention, athermoelectric module with excellent waterproof performance andexcellent dust-proof performance can be provided.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A thermoelectric element comprising: a firstmetal substrate; a first resin layer disposed on the first metalsubstrate; a second resin layer disposed on the first resin layer; afirst electrode disposed on the second resin layer; a semiconductorstructure disposed on the first electrode; and a second metal substratedisposed on the semiconductor structure, wherein the second resin layerincludes a first area which disposed between the first electrode and thefirst resin layer; and a second area other than the first area, whereina maximum thickness of the second area is larger than a maximumthickness of the first resin layer.
 2. The thermoelectric element ofclaim 1, wherein a maximum thickness of the first metal substrate islarger than the maximum thickness of the second area.
 3. Thethermoelectric element of claim 1, wherein the first resin layer is indirect contact with the first metal substrate, and wherein the secondresin layer is in direct contact with the first resin layer, wherein thesecond resin layer is in direct contact with the first electrode.
 4. Thethermoelectric element of claim 1, wherein the first resin layer doesnot contact with the first electrode.
 5. The thermoelectric element ofclaim 1, wherein an upper surface of the first area is lower than anupper surface of the second area.
 6. The thermoelectric element of claim5, wherein the first electrode is disposed on the upper surface of thefirst area.